Processes and apparatuses for treating halogen-containing gases

Details Processes and apparatuses for treating halogen-containing gases Processes and apparatuses for treating halogen-containing gases

2003-12-16

2008-08-05

Mayekar, Kishor (Department: 1795)

Chemical apparatus and process disinfecting, deodorizing, preser

Chemical reactor

With means applying electromagnetic wave energy or...

C204S252000

Reexamination Certificate

active

07407635

ABSTRACT:
There are disclosed various processes, apparatuses and systems for treating a halogen-containing gas such as F2that involve generating a plasma in order to reduce chemically the halogen-containing gas into products that are more environmentally manageable. According to a particular embodiment, a reducing agent is mixed with the halogen-containing gas to produce a feed gas mixture and a non-thermal plasma is generated in the feed gas mixture in the presence of liquid water.

REFERENCES:
patent: 3218781 (1965-11-01), Allemann et al.
patent: 3342721 (1967-09-01), Dibelius et al.
patent: 4489041 (1984-12-01), Wong et al.
patent: 4644877 (1987-02-01), Barton et al.
patent: 5187344 (1993-02-01), Mizuno et al.
patent: 5560844 (1996-10-01), Boulos et al.
patent: 5560890 (1996-10-01), Berman et al.
patent: 5637127 (1997-06-01), McLaughlin et al.
patent: 5750823 (1998-05-01), Wofford et al.
patent: 5817284 (1998-10-01), Nakano et al.
patent: 5843288 (1998-12-01), Yamamoto
patent: 5965786 (1999-10-01), Rostaing et al.
patent: 5980701 (1999-11-01), Sharma et al.
patent: 6187072 (2001-02-01), Cheung et al.
patent: 6193934 (2001-02-01), Yang
patent: 6290918 (2001-09-01), Rostaing et al.
patent: 6423284 (2002-07-01), Arno et al.
patent: 2002/0033377 (2002-03-01), Namose
patent: 2003/0161774 (2003-08-01), Josephson et al.
patent: 2004/0001787 (2004-01-01), Porshnev et al.
patent: 2005/0002842 (2005-01-01), Duncan et al.
patent: 0 820 801 (1997-07-01), None
patent: 1 224 964 (2001-03-01), None
patent: 10028836 (1998-02-01), None
patent: WO 01/12300 (2001-02-01), None
Evans et al., “Plasma remediation of trichloroethylene in silent discharge plasmas,”J. Appl. Phys.74(9):5378-5387, 1993.
Flippo et al., “Abatement of Fluorine Emissions Utilizing an ATMI CDO™ Model 863 with Steam Injection,” 2001.
Grothaus et al., “Harmful Compounds Yield to Nonthermal Plasma Reactor,” SwRI Technology Today, http:www.swri.rg, pp. 1-9 (published inTechnology Today, Spring 1996).
International Sematch Disclosure,“Evaluation of a Litmas “Blue” Point-of-Use (POU) Plasma Abatement Device for Perfluorocompound (PFC) Destruction,” Technology Transfer No. 98123605A-Eng, Dec. 15, 1998.
Lester, “Cleaning Process. No More PFC Emissions in Plasma Chamber Cleaning?”Semiconductorp. 46, 2000.
Rosenthal et al., “Corona Discharge Surface Treatment,”IEEE Trans. Ind. Appln., I-5:328-336, 1975.
Timms et al., “The chemistry of volatile waste from silicon wafer processing,”J. Chem. Soc.pp. 815-822, 1999.
Vartanian et al., “Plasma Abatement Reduces PFC Emission,”Semiconductor Internationalpp. 191-198, 2000.

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