Process useful in the fabrication of articles with metallized su

Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating

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156643, 427 38, C23C 1500

Patent

active

042149665

ABSTRACT:
A method has been devised for metallizing a desired area on a substrate during the manufacture of semiconductor devices. This process includes the steps of depositing a material such as a polymer resist on the substrate to delineate the area to be metallized. Then a suitable metal is deposited onto the coated substrate leaving a metallic film on both the exposed area of the substrate and on the delineating material. This metallic film is then substantially removed only from the delineating material by a technique which includes ion milling at an acute angle to the plane of the substrate. Conventional techniques are then employed to remove the delineating material.

REFERENCES:
patent: 3860783 (1975-01-01), Schmidt et al.
patent: 4004341 (1977-01-01), Tung
patent: 4016062 (1977-04-01), Mehta et al.
patent: 4093503 (1978-06-01), Harris et al.
Sumio Hosaka et al., Influence of Sample Inclination and Rotation During Ion-Beam Etching, J. Vac. Sci. Technol., vol. 15, No. 5, Sep./Oct., 1978, pp. 1712-1717.

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