Process to preserve silver metal while forming integrated circui

Details Process to preserve silver metal while forming integrated circui Process to preserve silver metal while forming integrated circui

1996-01-25

1997-09-30

Powell, William

Etching a substrate: processes

Masking of a substrate using material resistant to an etchant

216100, 1566561, 15665911, B44C 122, C23F 100

Patent

active

056722826

ABSTRACT:
A process to form integrated circuits comprising silver metal circuits. Deposition techniques such as sputtering, not plating, upon substrates to form such silver metal circuits are common. However in the conventional processes to remove the resist and the metal overlaying the resist, these conventional processes are deleterious to the silver metal. Thereby a new process is provided. This new process entails the metal overlaying the resist of the wafer is initially removed by a high pressure force. The resist, in this new process, is then removed by a benign stripper solution having the temperature of the solution raised to the highest temperature without degrading the stripper solution and said circuit is exposed to said stripper solution for one to five minutes.

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