Process to manufacture printed circuit boards

Details Process to manufacture printed circuit boards Process to manufacture printed circuit boards

1986-03-03

1990-01-30

Goodrow, John L.

Radiation imagery chemistry: process, composition, or product th

Electric or magnetic imagery, e.g., xerography,...

430 49, G03G 1322

Patent

active

048973262

ABSTRACT:
Printed circuit boards (PCBs) are disclosed comprising a support which on a major side carries circuit components in a desired design and on a second major side carries the soldered wires corresponding to said circuit components. Manufacturing of the PCBs is carried out by producing respective designs of the component and soldering sides as labile electrostatic images on which conductive metallic powder (toner) is applied. The so obtained images are printed on respective insulating sheets, one with the component side design, and another with the solder side design. The thus printed sheets are fixed on the PCB support, and the conductive designs are treated to increase the thickness of the design.

REFERENCES:
patent: 3862352 (1975-01-01), Berman
patent: 4327167 (1982-04-01), Tanabe
patent: 4350748 (1982-09-01), Lind
patent: 4371599 (1983-02-01), Lind et al.
patent: 4504529 (1985-03-01), Sorensen et al.
patent: 4548885 (1985-10-01), Brechlin
patent: 4661431 (1987-04-01), Bujese et al.

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