Process to apply photoresist printer to a wafer

Details Process to apply photoresist printer to a wafer Process to apply photoresist printer to a wafer

1995-09-29

1997-06-24

Powell, William

Coating processes

Coating by vapor, gas, or smoke

Organic coating applied by vapor, gas, or smoke

216 43, 427294, 427299, 430311, 438974, C23C 1600

Patent

active

056415419

ABSTRACT:
An improved method for applying a primer to a wafer surface prior to coating the wafer with photoresist is provided. The method comprises priming a wafer with HMDS, removing the wafer from the priming chamber, and closing the chamber. Next, the chamber, piping and primer source are evacuated. The bubbler canister, piping and wafer chamber are held at a pressure of about 15 inches H.sub.2 O while the priming tool is idle between wafer priming operations. By maintaining the vaporizer, piping and wafer chamber at a partial vacuum, the primer will be prevented from condensing and forming harmful droplets on the wafer surface. The invention prevents primer condensation from forming on the wafer, thus improving photolithographic yields and device yields.

REFERENCES:
patent: 3586554 (1971-06-01), Couture et al.
patent: 4332881 (1982-06-01), Shankoff

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