Process solutions containing surfactants used as...

Details Process solutions containing surfactants used as... Process solutions containing surfactants used as...

2006-09-12

2008-11-18

Carrillo, Sharidan (Department: 1792)

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

C134S002000, C134S025400, C134S026000, C134S028000, C134S029000, C134S030000, C134S034000, C134S036000, C134S041000, C134S902000

Reexamination Certificate

active

07452426

ABSTRACT:
Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce defects when employed as a rinse solution either during or after the development of the CMP processing. Also disclosed is a method for reducing the number of defects on a plurality of post-CMP processed substrates employing the process solution of the present invention.

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