Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
Reexamination Certificate
2007-04-24
2007-04-24
Carrillo, Sharidan (Department: 1746)
Cleaning and liquid contact with solids
Processes
For metallic, siliceous, or calcareous basework, including...
C134S002000, C134S025400, C134S026000, C134S028000, C134S029000, C134S030000, C134S034000, C134S036000, C134S041000, C134S902000
Reexamination Certificate
active
10689402
ABSTRACT:
Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce defects when employed as a rinse solution either during or after the development of the CMP processing. Also disclosed is a method for reducing the number of defects on a plurality of post-CMP processed substrates employing the process solution of the present invention.
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Ross Brenda Faye
Zhang Peng
Air Products and Chemicals Inc.
Carrillo Sharidan
Morris-Oskanian Rosaleen P.
Rossi Joseph D.
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