Process simulation method, process simulator and chemical vapor

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364578, G06F 1700

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active

055900518

ABSTRACT:
A process simulation method and a process simulator are disclosed wherein a simulation for optimum process conditions for formation of a dielectric film for a capacitor by a chemical vapor deposition method is executed using a non-empirical reaction model. The process simulator comprises an inputting apparatus for inputting parameters required to determine optimum process conditions, which provide the best step coverage for a dielectric film of a capacitor to be formed, as values defining given variation ranges, a storage apparatus for storing vapor phase reactions and film surface reactions individually corresponding to process condition sets each of which is a combination of a plurality of parameters as models obtained by a non-empirical method in advance, a simulation condition setting apparatus for setting process condition sets, a reaction model setting apparatus for recalling models from the storage apparatus in response to the thus set process condition sets, and a simulation execution apparatus for executing simulations in accordance with the thus recalled models and comparing results of the simulations with each other to select optimum process conditions.

REFERENCES:
patent: 5067101 (1991-11-01), Kunikiyo et al.
patent: 5070469 (1991-12-01), Kunikiyo et al.
patent: 5307296 (1994-04-01), Uchida et al.
patent: 5481475 (1996-01-01), Young
Ikegawa et al.; "Deposition Profile Simulation Using the Direct Simulation Monte Carlo Method"; J. Electrochem. Soc., vol. 136, No. 10, Oct. 1989, pp. 2982-2986.

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