Process plate for plastic pin grid array manufacturing

Details Process plate for plastic pin grid array manufacturing Process plate for plastic pin grid array manufacturing

1989-08-10

1990-11-20

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29721, 29759, 29760, 357 74, 439877, 361406, H01R 900, B23P 2100

Patent

active

049707817

ABSTRACT:
A process plate for the manufacture of molded electronic packages such as plastic pin grid array packages is provided. The process plate is a single fixture which is used to position terminal pins, align the pins for electrical interconnection and form the base of the mold during encapsulation. In one embodiment, the process plate comprises a support plate which is used for all standard terminal pin configurations and a thin cover plate which is specific for each terminal pin configuration. The process plate reduces the number of fixtures required to mold an electronic package reducing both cost and assembly error.

REFERENCES:
patent: Re32540 (1987-11-01), Murphy
patent: 3807045 (1979-04-01), Bennett et al.
patent: 4535535 (1985-08-01), Dines et al.
patent: 4549651 (1985-10-01), Alemanni
patent: 4816426 (1989-03-01), Bridges et al.
IBM Tech. Discl. Bull., vol. 22, No. 4, Sep. 1979, pp. 1508-1509 by Renz.
Jedec Registration MO-083 entitled "Solid State Product Outline", 7/1/88.
Materials Handbook (Eleventh Edition) by Brady et al., McGraw-Hill Book Company, 1977 at pp. 533-535, 579-581 and 609-612.

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