Process or non-electrolytic copper plating for printed circuit b

Details Process or non-electrolytic copper plating for printed circuit b Process or non-electrolytic copper plating for printed circuit b

1987-01-27

1987-09-15

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, C23C 1840

Patent

active

046939075

ABSTRACT:
A printed circuit board having a multi-layered copper plating film with excellent mechanical characteristics is obtained by a process of non-electrolytic copper plating comprising at least one sequence of the following steps (a)-(d):

REFERENCES:
patent: 3959523 (1976-05-01), Grunwald
patent: 4435189 (1984-03-01), Bovenkerk
patent: 4448804 (1984-05-01), Amelia

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