Process of using biocidal solutions containing copper sulfate

Details Process of using biocidal solutions containing copper sulfate Process of using biocidal solutions containing copper sulfate

1974-07-30

1976-11-16

Wolk, Morris O.

Compositions

Radioactive compositions

Nuclear reactor fuel

252106, 424141, 424143, A61K 3334, A61L 900, C11D 348

Patent

active

039921468

ABSTRACT:
Growth of fungus such as mold and mildew fungi is inhibited by applying to the surface to be protected an aqueous solution of a copper compound, such as copper sulfate, and a surfactant. The aqueous solution of copper compound and surfactant is especially effective for inhibiting the growth of microorganisms on hard porous surfaces such as grout seams associated with bathroom components such as bath tubs and ceramic tile shower stalls which are exposed to high humidity conditions for extended periods.
In one embodiment, growth of microorganisms is inhibited by applying the aqueous solution of copper compound and surfactant to hard porous surfaces in need of treatment. In another embodiment of the invention, an aqueous solution of copper compound and surfactant is used as the liquid source for forming the uncured mortar used to install or replace tiles.

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patent: 3705103 (1972-12-01), Cohen
patent: 3784357 (1974-01-01), Muraoka
chem. Abstracts; "17-Pharmaceuticals, Cosmetics, Perfumes"; 1951; 6801h.
McCutcheon; "Detergents & Emulsifiers"; 1969.

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