Process of using an active solder alloy

Details Process of using an active solder alloy Process of using an active solder alloy

1998-09-11

2000-04-11

Heinrich, Samuel M.

Metal fusion bonding

Process

Using high frequency vibratory energy

2281245, 228256, 228262, B23K 100, B23K 119, B23K 3526

Patent

active

060478764

ABSTRACT:
A process for joining workpieces by active soldering. The process includes cleaning the surfaces of the workpieces to be joined; heating the workpieces to be joined; placing an active, low-temperature solder material on at least one of the surfaces of the workpieces to be joined; mechanically activating the molten solder material, to break oxide films on the solder material, while the solder material contacts the surfaces of the workpieces to be joined; assembling the surfaces of the workpieces to be joined; and applying pressure to the surfaces of the workpieces to be joined both while the solder material is molten and as the solder material cools to a solid.

REFERENCES:
patent: 4451541 (1984-05-01), Beal
patent: 4785989 (1988-11-01), Mizuhara et al.
patent: 5011511 (1991-04-01), Beck
patent: 5598966 (1997-02-01), Romano et al.
patent: 5695861 (1997-12-01), Bloom
German Search Report dated Nov. 12, 1996.
A. P. Xian, "Precursor film in a metal-ceramic wetting system," Welding In The World, vol. 30, No. 9/10, Sep. 1, 1992, pp. 243-251.
U.S. Patent application No. 08/983,472, Filed Apr. 23, 1998.
International Search Report dated Dec. 22, 1998.

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