Process of using a jig to align and mount terminal conductors to

Details Process of using a jig to align and mount terminal conductors to Process of using a jig to align and mount terminal conductors to

1993-11-16

1995-04-04

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437217, 257738, 257780, 22818022, H01L 2128, H01L 2156, H01L 2158, H01L 2160

Patent

active

054037760

ABSTRACT:
A process of manufacturing semiconductor device accommodated in a package including a semiconductor chip, a package body for accommodating the semiconductor chip, and a plurality of terminal members embedded in the package body in electrical connection to the semiconductor chip and projecting from a bottom surface of the package body, wherein each of said terminal members is of spherical form, such that the terminal members roll substantially freely when placed on a flat surface, and of a substantially identical diameter.

REFERENCES:
patent: 3959874 (1976-06-01), Coucoulas
patent: 4530152 (1985-07-01), Roche et al.
patent: 4994902 (1991-02-01), Okahashi et al.
E. Stephens, "Pinless Module Connector," IBM Technical Disclosure Bulletin, vol. 20, No. 10, Mar. 1978, p. 3872.
J. Lyman, "Solder Columns Secure Chip Carriers to Epoxy," Electronics, vol. 58, No. 37, Sep. 16, 1985, pp. 20-21.

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