Process of treating a nodic oxide film, printed wiring board and

Details Process of treating a nodic oxide film, printed wiring board and Process of treating a nodic oxide film, printed wiring board and

1982-02-01

1984-11-20

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

174 685, 204 376, 204 38A, 204 38E, 204 58, 204181R, 427 96, C25D 1106, C25D 1118

Patent

active

044837518

ABSTRACT:
A process of treating an anodic oxide film wherein a base material of a valve metal is anodized to form the anodic oxide film thereon, which is then impregnated with a polymerizable organic metal compound and thereafter subjected to polymerization of the compound, whereby the micropores of the anodic oxide film are filled and sealed with the polymerized organometallic compound. According to this process, there is provided a base material having an anodic oxide film impregnated with polymerized organometallic compound which is excellent in heat resistance, heat radiance, and electrical insulation, and hence the base material is useful for the printed wiring board, electrically-insulative heat sink, heat-resistant insulated wire and the like.

REFERENCES:
patent: 3202591 (1965-08-01), Curran
patent: 3340161 (1967-09-01), Zimmerman et al.
patent: 3622473 (1971-11-01), Ohta et al.
patent: 3711313 (1973-01-01), Nagano
patent: 4130466 (1978-12-01), Kramer
patent: 4180442 (1979-12-01), Byrd
patent: 4318939 (1982-03-01), Wong
W. E. Hubner et al., The Practical Anodizing of Aluminum, McDonald and Evans, London, 1960, pp. 44-46.
J. E. Lilienfeld et al., . . . Anodic Layers on Aluminum, The Electrochemical Society, New York, 1935, pp. 67-73.

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