Process of transfer of mask pattern onto substrate and apparatus

Optics: measuring and testing – Blood analysis – Hemoglobin concentration

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G01B 1100

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active

046995153

ABSTRACT:
In an exposure apparatus for manufacturing semiconductor devices, a pattern on a photomask is aligned with a plurality of patterns formed on a wafer in a manner that detects and corrects misalignment, including, inter alia, rotational errors, not only between a photomask and a wafer, but also between a photomask and individual chips formed on the wafer, so that pattern matching is attained with very high accuracy. Apparatus for achieving this result employs different arrangements of alignment marks together with optical systems and positional adjustment devices.

REFERENCES:
patent: 4057347 (1977-11-01), Moriyama et al.
patent: 4362389 (1982-12-01), Koizumi et al.
patent: 4385838 (1983-05-01), Nakazawa et al.
patent: 4423959 (1984-01-01), Nakazawa et al.

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