Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1996-10-31
2000-04-04
Ballato, Josie
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
324765, G01R 3102
Patent
active
060466006
ABSTRACT:
A semiconductor wafer has integrated circuit dies formed in an array of rows and columns. Selector circuits occur in the areas between the dies and are electrically connected to the individual dies for selecting between a functional mode and a bypass mode for testing. Probe areas are formed on the periphery of the wafer for accepting probe pins without contacting the bond pads of the dies. The dies and selector circuits are electrically connected to the probe areas for conducting electrical testing of the dies. The testing occurs by selecting only one die in a particular row and column and maintaining the remaining dies in a standby mode.
REFERENCES:
patent: 4956602 (1990-09-01), Parrish
patent: 5241266 (1993-08-01), Ahmad et al.
patent: 5278494 (1994-01-01), Obigane
patent: 5279975 (1994-01-01), Devereaux et al.
patent: 5286656 (1994-02-01), Keown et al.
patent: 5291025 (1994-03-01), Smith
patent: 5313158 (1994-05-01), Joosten et al.
patent: 5315241 (1994-05-01), Ewers
patent: 5334857 (1994-08-01), Mennitt et al.
patent: 5366906 (1994-11-01), Wojnarowski et al.
patent: 5371390 (1994-12-01), Mohsen
patent: 5389556 (1995-02-01), Rostoker et al.
patent: 5389873 (1995-02-01), Ishii et al.
patent: 5390131 (1995-02-01), Rohrbaugh et al.
patent: 5391984 (1995-02-01), Worley
patent: 5399505 (1995-03-01), Dasse et al.
patent: 5424651 (1995-06-01), Green et al.
patent: 5446395 (1995-08-01), Goto
patent: 5457400 (1995-10-01), Ahmad et al.
patent: 5461328 (1995-10-01), Devereaux et al.
patent: 5489538 (1996-02-01), Rostoker et al.
patent: 5532174 (1996-07-01), Corrigan
patent: 5534786 (1996-07-01), Kaneko et al.
patent: 5557573 (1996-09-01), McClure
patent: 5608335 (1997-03-01), Tailliet
patent: 5619462 (1997-04-01), McClure
patent: 5648661 (1997-07-01), Rostoker et al.
Ballato Josie
Bassuk Lawrence J.
Donaldson Richard L.
Kobert Russell M.
Texas Instruments Incorporated
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