Process of selecting dies for testing on a wafer

Details Process of selecting dies for testing on a wafer Process of selecting dies for testing on a wafer

1999-10-12

2000-12-26

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324763, G01R 3128

Patent

active

061665576

ABSTRACT:
Integrated circuit die on wafer are electronically selected for testing using circuitry (161, 201, PA1-PA4) provided on the wafer.

REFERENCES:
patent: 4956602 (1990-09-01), Parrish
patent: 4961053 (1990-10-01), Krug
patent: 5070297 (1991-12-01), Kwon et al.
patent: 5442282 (1995-08-01), Rostoker et al.
patent: 5483175 (1996-01-01), Ahmad et al.

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