Process of resin sealing a semiconductor device and lead frame

Details Process of resin sealing a semiconductor device and lead frame Process of resin sealing a semiconductor device and lead frame

1997-04-04

1999-10-19

Graybill, David E.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438124, 438126, H01L 2156, H01L 2158, H01L 2160

Patent

active

059703202

ABSTRACT:
A semiconductor device comprises an electrically insulating film having a device hole; a plurality of groups of leads, each group including of a large number of leads arranged in a predetermined pattern, in a plurality of lead formation regions on the surface of the film; an integrated circuit chip positioned within the device hole and with electrodes connected to inner lead portions of the leads; and a resin sealing portion that seals in at least the integrated circuit chip, the film, and the lead groups. The film comprises a first group of aperture portions including of aperture portions provided in regions outside the lead formation regions and a second group of aperture portions consisting of a plurality of aperture portions provided in the lead formation regions.

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