Process of removing soldering flux and/or adhesive tape residue

Details Process of removing soldering flux and/or adhesive tape residue Process of removing soldering flux and/or adhesive tape residue

1992-06-09

1994-08-23

Breneman, R. Bruce

Cleaning and liquid contact with solids

Processes

Using sequentially applied treating agents

134 40, 134 42, B08B 308

Patent

active

053404076

ABSTRACT:
Disclosed is an industrial cleaning process in which a contaminant comprising soldering flux and/or adhesive tape residue is removed from a substrate contaminated therewith. The process comprises the steps of contacting the substrate with a terpene-based cleaning composition which is substantially free of water-soluble organic material; removing the composition and solubilized contaminant from the substrate by contact with water having a temperature of about 70.degree. F. to about 140.degree. F. for a period of time of no longer than about 10 minutes to provide a substrate having a contamination rating of no greater than about 14 micrograms NaCl equivalent/square inch (MIL-P-28809A), and to thereby form a mixture comprising the composition, contaminant and water. The process also comprises separating the water from said mixture, the separated water being substantially free of water-soluble organic material and having a chemical oxygen demand of no greater than about 1,000 ppm.

REFERENCES:
patent: 4740247 (1988-04-01), Hayes et al.
patent: 4790951 (1988-12-01), Frieser et al.
patent: 4867800 (1989-09-01), Dishart et al.
patent: 4983224 (1991-01-01), Mombrun et al.

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