Process of producing plastic-molded printed circuit boards

Plastic and nonmetallic article shaping or treating: processes – With step of making mold or mold shaping – per se – Utilizing surface to be reproduced as an impression pattern

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

264227, 26427211, 26427215, 26427217, B29C 3340

Patent

active

047643277

ABSTRACT:
A process of producing plastic-molded printed circuit boards by injection-molding a heat resistant plastic to form a plastic molding having many perforations and forming a conductive layer on the molding, which comprises molding the heat resistant plastic using a mold for injection-molding obtained by preparing a die set for injection-molding composed of a fixed side metal platen having at least an inlet for molten resin and forming a space for installing mold part(s), a stripper metal platen having, if necessary, an inlet for molten resin connected to the fixed side metal platen and forming a space for installing mold part(s), and a movable side metal platen forming a space for installing mold part(s); and assembling a pair of molds composed of a mold I having a concaved portion for cavity and a mold II having perforations for passing hard pins for forming holes and, if desired, a concaved portion for cavity, said molds being formed by a cured resin composition or a composite of a metal and a cured resin composition, and a hard pin mold III having hard pins for forming holes fixed thereto in such a manner that

REFERENCES:
patent: 4213238 (1980-07-01), Gudorf
patent: 4368168 (1983-01-01), Slepcevic
patent: 4395817 (1983-08-01), Asada et al.
patent: 4470786 (1984-09-01), Sano et al.
patent: 4513942 (1985-04-01), Creasman
patent: 4536364 (1985-08-01), Lindskog
patent: 4650625 (1987-03-01), Pentlow
patent: 4653993 (1987-03-01), Boschman
patent: 4681718 (1987-07-01), Oldham
patent: 4688152 (1987-08-01), Chia

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process of producing plastic-molded printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process of producing plastic-molded printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process of producing plastic-molded printed circuit boards will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-599480

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.