Plastic and nonmetallic article shaping or treating: processes – With step of making mold or mold shaping – per se – Utilizing surface to be reproduced as an impression pattern
Patent
1987-01-14
1988-08-16
Wyse, Tom
Plastic and nonmetallic article shaping or treating: processes
With step of making mold or mold shaping, per se
Utilizing surface to be reproduced as an impression pattern
264227, 26427211, 26427215, 26427217, B29C 3340
Patent
active
047643277
ABSTRACT:
A process of producing plastic-molded printed circuit boards by injection-molding a heat resistant plastic to form a plastic molding having many perforations and forming a conductive layer on the molding, which comprises molding the heat resistant plastic using a mold for injection-molding obtained by preparing a die set for injection-molding composed of a fixed side metal platen having at least an inlet for molten resin and forming a space for installing mold part(s), a stripper metal platen having, if necessary, an inlet for molten resin connected to the fixed side metal platen and forming a space for installing mold part(s), and a movable side metal platen forming a space for installing mold part(s); and assembling a pair of molds composed of a mold I having a concaved portion for cavity and a mold II having perforations for passing hard pins for forming holes and, if desired, a concaved portion for cavity, said molds being formed by a cured resin composition or a composite of a metal and a cured resin composition, and a hard pin mold III having hard pins for forming holes fixed thereto in such a manner that
REFERENCES:
patent: 4213238 (1980-07-01), Gudorf
patent: 4368168 (1983-01-01), Slepcevic
patent: 4395817 (1983-08-01), Asada et al.
patent: 4470786 (1984-09-01), Sano et al.
patent: 4513942 (1985-04-01), Creasman
patent: 4536364 (1985-08-01), Lindskog
patent: 4650625 (1987-03-01), Pentlow
patent: 4653993 (1987-03-01), Boschman
patent: 4681718 (1987-07-01), Oldham
patent: 4688152 (1987-08-01), Chia
Nakamura Hirokatsu
Nozaki Mitsuru
Mitsubishi Gas Chemical Company Inc.
Wyse Tom
LandOfFree
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