Process of producing IC cards

Details Process of producing IC cards Process of producing IC cards

1993-08-26

2000-03-14

Osele, Mark A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156268, 156291, 156292, B32B 3118, B32B 3126

Patent

active

060367970

ABSTRACT:
A process of producing an IC card, the IC card having a card substrate and an IC module embedded therein, the card substrate having a single core sheet and first and second cover films laminated over the core sheet on the opposite sides, the process including the steps of forming an adhesive layer on the inside of each of the first and second cover films except a non-adhesive area in which the IC module is to be fitted; bonding the cover films to the opposite sides of the core sheet through the adhesive layers to form the card substrate having the non-adhesive area; cutting the non-adhesive areas of the card substrate along their outer peripheries to form a cavity for receiving the IC module; fitting the IC module into the cavity; and
fixedly securing the IC module to the card substrate.

REFERENCES:
patent: 3508754 (1970-04-01), Shorin
patent: 4457798 (1984-07-01), Hoppe et al.
patent: 4749432 (1988-06-01), Ando et al.
patent: 4923545 (1990-05-01), Dickerson
International Standard--ISO-7816-1, "Identification Cards--Integrates Circuit(s) Cards With Contacts," Jul. 1, 1987 First Edition.

Affiliated with

Also associated with

Rating

Process of producing IC cards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process of producing IC cards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process of producing IC cards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-165245