Process of producing copper plated resin article

Details Process of producing copper plated resin article Process of producing copper plated resin article

1989-11-07

1992-04-21

Niebling, John F.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating predominantly nonmetal substrate

427 96, 427 97, 427229, 427252, 205184, 205927, C23C 2800

Patent

active

051064626

ABSTRACT:
Process for producing a copper plated resin article by forming a uniform copper coating having excellent adhesive strength on a fiber-reinforced or unreinforced thermoplastic or thermosetting resin article having a heat deformation temperature higher than 165.degree. C. The resin article is heated along with a source of copper formate under a reduced pressure or in a non-oxidative atmosphere to a temperature in the range above 165.degree. C. but lower than the heat deformation temperature of the resin article. The process makes it possible to produce a resin article having formed thereon a copper layer having an excellent adhesive strength by a very simple manner, and the resin article thus obtained can be used in various industrial fields.

REFERENCES:
patent: 4913938 (1990-04-01), Kawakami et al.
Soviet Inventions Illustrated, week B26, Aug. 8, 1979, section Chemical, abstract No. 486528/26, Derwent Publications Ltd., London, GB; SU-A-621 801 (Ermolaev, . RMOLAV VI.) Jul. 21, 1978.
Soviet Inventions Illustrated, week Y23, Jul. 19, 1977, G 02, abstract No. 4111Y/23, Derwent Publication Ltd., London, GB; & SU-A-523 963 (AS Ukr Water Chem.) Oct. 22, 1976.

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