Process of producing copper-alloy and copper alloy plate used fo

Details Process of producing copper-alloy and copper alloy plate used fo Process of producing copper-alloy and copper alloy plate used fo

1983-09-22

1984-08-21

Skiff, Peter K.

Alloys or metallic compositions

Copper base

Nickel containing

148 115C, 148 127C, 420487, C22C 906, C22F 108

Patent

active

044669399

ABSTRACT:
This invention provides an economic copper-nickel alloy having high strength and high conductivity for lead conductor materials and/or lead frames for transistors, integrated circuits, and the like. The copper alloy comprises a composite of copper and inexpensive elements comprising 3.0% by weight nickel; from 0.01 to 1.0% by weight silicon; and from 0.01 to 0.1% by weight phosphorus. In one preferred embodiment a specific weight % of iron is also added. Still further, an improved method is provided for fabricating the alloy according to a specific series and sequence of steps, including steps at specific conditions and for specific times, for providing precipitation hardening. Other advantageous properties comprise desirable elongation.

REFERENCES:
patent: 3522112 (1970-07-01), McLain
patent: 4249941 (1981-02-01), Futatsuka et al.
patent: 4337089 (1982-06-01), Arita et al.
patent: 4362579 (1982-12-01), Tsuji

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