Process of producing a compound material of chromium and copper

Details Process of producing a compound material of chromium and copper Process of producing a compound material of chromium and copper

1983-07-13

1985-03-05

Sebastian, Leland A.

Powder metallurgy processes

Powder metallurgy processes with heating or sintering

Post sintering operation

75245, 200264, 252512, B22F 300

Patent

active

045030103

ABSTRACT:
In the method according to the invention, Cr powder is poured into a degased mold, which can be made of graphite. On this Cr powder a piece of low-oxygen copper is placed. Subsequently, the mold is closed with a porous cover, which can also be made of graphite. Then the mold is degased in a high-vacuum furnace at room temperature until a pressure of better than 10.sup.-4 mb is reached. Thereafter, the furnace temperature is increased to as high as possible a temperature below the melting point of copper. This furnace temperature is maintained constant until an internal pressure in the furnace of better than 10.sup.-4 mb is reached. Subsequently, without intermediate cooling, the furnace temperature is further increased slowly to a final value of 100 degrees K. to 200 degrees K. above the melting temperature of the copper. This temperature is then maintained until the porosity contained in the Cr powder is completely filled up by the liquid copper.

REFERENCES:
patent: 3818163 (1974-06-01), Robinson
patent: 3957453 (1976-05-01), H/a/ ssler et al.
patent: 4147909 (1979-04-01), H/a/ ssler et al.

Affiliated with

Also associated with

Rating

Process of producing a compound material of chromium and copper does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process of producing a compound material of chromium and copper, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process of producing a compound material of chromium and copper will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1733820