Process of pressureless sintering to produce dense high thermal

Details Process of pressureless sintering to produce dense high thermal Process of pressureless sintering to produce dense high thermal

1985-04-12

1986-03-25

McCarthy, Helen M.

Plastic and nonmetallic article shaping or treating: processes

Including step of generating heat by friction

264 61, 264 63, 501 96, 501 98, 501152, 501153, C04B 3558, F27D 706

Patent

active

045782342

ABSTRACT:
A process for producing an aluminum nitride ceramic body having a composition defined and encompassed by polygon JKLM but not including line MJ of FIG. 4 and a thermal conductivity greater than 1.00 W/cm.multidot.K at 25.degree. C., preferably greater than 1.42 W/cm.multidot.K at 25.degree. C., which comprises forming a mixture comprised of aluminum nitride powder containing oxygen, yttrium oxide, and free carbon, shaping said mixture into a compact, said mixture and said compact having a composition wherein the equivalent % of yttrium and aluminum ranges from point L to less than joint J of FIG. 4, said compact having an equivalent % composition of Y, Al, O and N outside the composition defined and encompassed by polygon JKLM of FIG. 4, heating said compact up to a temperature at which its pores remain open reacting said free carbon with oxygen contained in said aluminum nitride producing a deoxidized compact, said deoxidized compact having a composition wherein the equivalent % of Al, Y, O and N is defined and encompassed by polygon JKLM but not including line MJ of FIG. 4, and sintering said deoxidized compact at a temperature of at least about 1860.degree. C. producing said ceramic body.

REFERENCES:
patent: 3833389 (1974-09-01), Komeya et al.
patent: 3930875 (1976-01-01), Ochiai et al.
patent: 4097293 (1978-06-01), Komeya et al.
patent: 4203733 (1980-05-01), Tanaka et al.
patent: 4435513 (1984-03-01), Komeya et al.
patent: 4478785 (1984-10-01), Huseby et al.
patent: 4519966 (1985-05-01), Aldinger et al.
patent: 4533645 (1985-08-01), Huseby et al.
patent: 4540673 (1985-09-01), Takeda et al.
patent: 4547471 (1985-10-01), Huseby et al.
Werdecker, W. et al.-"Aluminum Nitride-An Alternative Ceramic Substrate for High Power Applications in Micro Circuits", IEEE, May 1984 (pp. 402-406).
K. Shinozaki, et al., "Sintering Behavior and Thermal Characteristics of Pressureless Sintered AlN with Y.sub.2 O.sub.3 Addition," 22nd Symposium on Basic Science of Ceramics, Yogyo-Kyokai, Jan. 1984, p. 43.
Ceramic Bulletin, vol. 63, No. 8 (1984), p. 1009.
Heraeus PS-B-80 4 pages.
"Effects of Various Additives on Sintering of Aluminum Nitride", Komeya et al--before 1983.
"Science of Ceramics", vol. 6, 1973, pp. XX/3-XX13.
Komeya et al., Trans. & J. Brit. Ceram. Soc. 70 (3), 107-113 (1971) "The Infuence of Fibrous Aluminum Nitride on the Strength of Sintered AlN-Y.sub.2 O.sub.3 ".
Advanced Optical Ceramics. Phase III, Final Report, DIN:82SDR2006, Feb. 1982, pp. 4-68 to 4-80 and pp. 4-127 to 4-137, especially pp. 4-128 and 4-129.
Slack, G. A. "Nonmetalic Crystals with High Thermal Conductivity", J. Phys. Chem. Solids, 1973, vol. 34, pp. 321-335.
Litvinenko, V. F. et al. "Thermophysical Properties of Aluminum Nitride-Yttria Materials", translated from Poroshkovaya Metallurgiya, No. 6(246), pp. 77-79, Jun., 1983, pp. 490-492.
Schwetz, K. A. et al. "Sintering of Aluminum Nitride with Low Oxide Addition", Progress in Nitrogen Ceramics (1983) pp. 245-252.
Iwase, N. et al. "Development of a High Thermal Conductive AlN Ceramic Substrate Technology", The International Journal for Hybrid Microelectronics, vol. 7, #4, Dec. 1984--copy received Sep. 1984.

Affiliated with

Also associated with

Rating

Process of pressureless sintering to produce dense high thermal does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process of pressureless sintering to produce dense high thermal , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process of pressureless sintering to produce dense high thermal will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-629714