Process of preparing high-density sintered ITO compact and sputt

Details Process of preparing high-density sintered ITO compact and sputt Process of preparing high-density sintered ITO compact and sputt

1996-04-15

2000-03-07

Derrington, James

Plastic and nonmetallic article shaping or treating: processes

Outside of mold sintering or vitrifying of shaped inorganic...

Involving specified composition of heating atmosphere, other...

20429812, 20429813, 501126, 501134, C04B 35457

Patent

active

06033620&

ABSTRACT:
A sintered ITO compact is provided which is capable of retarding nodule formation, or particle generation. The sintered ITO compact is composed of In, Sn, and O, and has avelage length of void size of not larger than 0.7 .mu.m. This sintered ITO compact is produced by sintering, substantially in an oxygen atmosphere, a green compact formed from a mixed powder of indium oxide power and tin oxide powder, the mixed powder containing the tin oxide powder at a content ranging from 5% to 15%, and the tin oxide powder having particles of a particle size of not more than 1 .mu.m constituting not less than 90% portion thereof; or produced by sintering, in an oxygen atmosphere, a green compact formed from a mixed powder of indium oxide powder and tin oxide powder, the mixed powder having a tap density of not less than 1.8 g/cm.sup.3, and the tin oxide powder having a maximum particle size of not larger than 1 .mu.m and a median diameter of not larger than 0.4 .mu.m.

REFERENCES:
patent: 5071800 (1991-12-01), Iwamoto et al.
patent: 5401701 (1995-03-01), Ogawa et al.
patent: 5433901 (1995-07-01), Rancoule et al.
patent: 5435826 (1995-07-01), Sakakibara et al.
patent: 5700419 (1997-12-01), Matsunaga et al.

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