Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal
Reexamination Certificate
2005-01-25
2005-01-25
Zarabian, Amir (Department: 2822)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
C438S025000, C438S026000, C438S029000, C438S034000, C257S081000, C257S088000, C257S079000, C257S099000
Reexamination Certificate
active
06846687
ABSTRACT:
A process of packaging an OEL panel is disclosed. A printed circuit board is provided, wherein the printed circuit board comprises a plurality of bonding pads and a plurality of bumps on the bonding pads. Next, at least one OEL panel having a plurality of polysolder interconnections is provided. Next, the OEL panel disposed on the printed circuit board. A reflow process is performed so that the OEL panel can electrically connect with the PCB by the polysolder interconnections. Because of the low-temperature reflow process, the process of packaging an OEL panel can be accomplished by a low temperature process.
REFERENCES:
patent: 5747363 (1998-05-01), Wei et al.
patent: 5869929 (1999-02-01), Eida et al.
patent: 6180960 (2001-01-01), Kusuda et al.
patent: 6496973 (2002-12-01), Kusuda et al.
patent: 6583442 (2003-06-01), Ito
patent: 6621213 (2003-09-01), Kawashima
patent: 6727519 (2004-04-01), Wu
patent: 20020084536 (2002-07-01), Sundahl et al.
patent: 20030141807 (2003-07-01), Kawase
Chen Shang-Wei
Hsu Shih-Ming
Tang Tung-Yang
Wu Chin-Long
RiTdisplay Corporation
Tran Thanh Y.
Zarabian Amir
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