Process of packaging an integrated circuit with a conductive mat

Details Process of packaging an integrated circuit with a conductive mat Process of packaging an integrated circuit with a conductive mat

1994-10-27

1998-11-24

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438124, 438127, H01L 2156, H01L 2158, H01L 2160

Patent

active

058405992

ABSTRACT:
A process for manufacturing a lead frame (10) connected over an integrated circuit (40) by adhesives (42) and (44). Each lead conductor (16) and (18) of the lead frame (10) has the identical geometric area in order to provide identical capacitances. A metal shield may be provided on adhesives (42) and (44) to provide noise shielding for the integrated circuit (40).

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