Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
1999-10-06
2002-09-03
Sherry, Michael (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S124000
Reexamination Certificate
active
06444494
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a process for manufacturing a semiconductor device and, particularly to a process for manufacturing a semiconductor device wherein a film substrate is adhered to an electrode-forming surface of a semiconductor chip.
2. Description of the Related Art
FIG. 11
illustrates one example of a so-called chip-size package formed by adhering a film substrate
12
onto an electrode terminal-forming surface of a semiconductor surface of a semiconductor chip
10
. The film substrate
12
has a circuit pattern
16
with lands on one side surface of an electrically-insulating base film
14
of polyimide or others, and carries an adhesive layer
18
on the other surface to be adhered onto the electrode terminal-forming surface of the semiconductor chip
10
. The semiconductor device illustrated in
FIG. 11
carries the semiconductor chip
10
provided with two rows of electrodes
20
arranged in the lengthwise direction in a generally central region of the electrode terminal-forming surface thereof. An opening for a wire-bonding operation is formed at a center of the film substrate
12
, through which the electrode terminals
20
are connected to bonding parts
22
of the circuit pattern
16
via bonding wires
24
. Reference numeral
26
denotes an external connection terminal bonded to the land of the circuit pattern
16
, and
28
denotes a shield resin for shielding the bonded portion.
Reduction in size of the semiconductor chip
10
is a recent trend for the purpose of increasing the number thereof obtainable from one wafer, which in turn results in the difficulty in arranging external connection terminals within a space corresponding to the electrode terminal-forming surface of the minimized semiconductor chip
10
, because a circuit board on which the semiconductor device is mounted or an external connection terminal, such as a solder ball, still adopts the conventional mounting method.
Therefore, as shown in
FIG. 12
, there might be a case wherein the film substrate
12
on which the external connection terminals are arranged becomes larger than the minimized semiconductor chip
10
. If the semiconductor chip
10
is smaller than the film substrate
12
as described above, the peripheral region (designated as “A” in the drawing) of an area defined on a surface of the film substrate
12
could not be supported by the semiconductor chip
10
, which requires taking some measures for the reinforcement of the peripheral region of the film substrate
12
.
FIGS.
13
(
a
) to
13
(
c
) show the prior art steps for manufacturing the semiconductor device in which the semiconductor chip
10
is smaller in size than the film substrate
12
.
FIG.
13
(
a
) illustrates a rectangular film substrate tape
120
cut off from a long-sized film substrate tape in which a plurality of film substrates are consecutively arranged. The film substrate tape
120
is divided into sections having the same circuit pattern
16
, for mounting the semiconductor chips
10
, respectively. Each of the sections has a bonding opening
15
extending in the longitudinal direction in the middle portion thereof.
FIG.
13
(
b
) illustrates the film substrate tape
120
secured onto a carrier frame
30
for assuredly carrying out various steps for the manufacturing, such as mounting of semiconductor chip, wire-bonding or shielding. The carrier frame
30
is made of a metallic sheet or the like into a frame shape, and serves to support the periphery of the film substrate tape.
Then, a reinforcement member
32
is bonded to the peripheral region of the respective section on a side of the film substrate
12
to which the semiconductor chip
10
is to be adhered (a side opposite to that carrying the circuit pattern) (see FIG.
13
(
c
)). The reinforcement member
32
is of a frame shape formed in conformity with the contour of the film substrate
12
and a size of the semiconductor chip
10
. The reinforcement member
32
is made of a resinous material having a high shape-retaining ability such as a polyimide tape or a thin metallic plate. The reinforcement member
32
is formed separately from the film substrate tape
120
and the carrier frame
30
, and is individually adhered to the film substrate tape
12
by an adhesive layer
18
provided on the film substrate tape
120
.
After the reinforcement member
32
has been adhered to the respective film substrate
12
of the film substrate tape
120
, the semiconductor chip
10
is adhered. Thereafter, a bonding part
22
of the circuit pattern
16
is wire-bonded to an electrode terminal
20
of the semiconductor chip through the opening of the film substrate
12
. After exposed portions of the bonding parts
22
or others have been resin-shielded and the external connection terminals have been bonded to the lands of the circuit pattern, the respective film substrates
12
are cut into sections from the film substrate tape
120
to result in individual semiconductor devices.
FIGS.
14
(
a
) and
14
(
b
) are a side sectional view and a bottom view, respectively, of the semiconductor device thus obtained. As apparent therefrom, the outer peripheral region of the film substrate
12
is strengthened with the reinforcement member
32
adhered to the side of the former on which the semiconductor chip
10
is mounted.
The prior art process for manufacturing the semiconductor device described above includes the steps of supporting the film substrate tape
120
by the carrier frame
30
, and adhering the reinforcement member
32
to the film substrate tape
120
. Such a manufacturing process has drawbacks in that a material cost is expensive and the manufacturing steps are complicated because the semiconductor device is formed by combining the film substrate tape
120
, the carrier frame
30
and the reinforcement member with each other.
SUMMARY OF THE INVENTION
An object of the present invention is to provide a process for easily manufacturing a semiconductor device of a good quality by improving the prior art manufacturing process so that the manufacturing steps are simplified to reduce the manufacturing cost.
According to the present invention, there is provided with a process for manufacturing a semiconductor device, the process comprising the following steps of: separating individual film substrates from a film substrate tape having a plurality of film substrates continuously and integrally connected to each other, each film substrate comprising a base film having first and second surfaces, a circuit pattern being formed on the first surface and a semiconductor element mounting section being formed on the second surface, the base film having an opening to which electrode terminals of a semiconductor element are exposed when the semiconductor element is mounted; adhering the individual film substrates to respective reinforcement members of a reinforcement frame having a plurality of the reinforcement members continuously and integrally connected to each other, each reinforcement member having an accommodation hole for accommodating the semiconductor element, so that the semiconductor element mount section is exposed in the accommodation hole; mounting the semiconductor element on the film substrate by adhering an electrode terminal-forming surface of the semiconductor element to said mounting section so that electrode terminals of the semiconductor element are exposed in the accommodation hole; electrically connecting the electrode terminals exposed in the opening to the circuit patterns; sealing the opening with resin; and separating the individual reinforcement members from the reinforcement frame.
The electrode terminals of the semiconductor element can be electrically connected to the circuit patterns by wire-bonding.
The film substrate is such that tip ends of the circuit pattern extend into the opening as lead portions.
The reinforcement frame may comprise a frame base and the plurality of reinforcement members suspended by the frame base. The reinforcement frame may be a metallic reinforceme
Kurihara Takashi
Muramatsu Shigetsugu
Pert Evan
Sherry Michael
Shinko Electric Industries Co. Ltd.
Staas & Halsey , LLP
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