Process of mounting clay rope on cardboard

Details Process of mounting clay rope on cardboard Process of mounting clay rope on cardboard

1981-07-16

1988-06-07

Silbaugh, Jan H.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156334, 164137, 249174, 249204, 264241, 264242, 277189, 277228, 277229, 277DIG6, B22D 3304, B29C 5304, F16J 1510

Patent

active

047494298

ABSTRACT:
A sealing structure is disposed between a metal-casting ingot mold bottom portion and a bottom plate to prevent the leakage of molten steel between the mold and plate. A clay rope disposed in a closed configuration corresponding to the bottom of the ingot mold is affixed to the cardboard sheet with an adhesive system. Overlapping portions of the cardboard sheet are grasped to position the clay rope directly under the ingot mold, and the mold is lowered onto the bottom plate. Hot glue (or pressure sensitive adhesive tape and/or white glue) holds the clay rope on the cardboard sheet. The clay rope is offset at a central portion of the sheet to allow folding of the sheet for transport.

REFERENCES:
patent: 1164739 (1915-12-01), Mershon
patent: 2148054 (1939-02-01), Berlek
patent: 2970905 (1961-02-01), Doll
patent: 3137602 (1964-06-01), Lincoln
patent: 3418410 (1968-12-01), EinFalt
patent: 3435501 (1969-04-01), Paul
patent: 4111706 (1978-09-01), LaBate
patent: 4369830 (1983-01-01), Generali

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