Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2002-12-06
2004-08-24
Le, Dung A. (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S122000, C438S123000, C257S787000
Reexamination Certificate
active
06780681
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a wiring substrate for resin molding and a process for manufacturing a semiconductor device into which this wiring substrate is incorporated.
2. Description of the Related Art
As shown in
FIG. 8
, a board-on-chip (BOC) type semiconductor device is composed in such a manner that a semiconductor chip
12
is fixed to a semiconductor chip mounting section, which is formed on one face of the resin substrate
10
, with adhesive
11
. Wiring patterns
13
, which are formed on the other face of the resin substrate
10
, and a terminal section of the semiconductor chip
12
, are electrically connected with each other by a bonding wire
15
inserted into a through-hole (slit)
14
formed on the resin substrate
10
. Reference numeral
16
is a ball terminal used for the connection with the outside. This ball terminal
16
is arranged on the wiring pattern
13
.
A simple BOC type semiconductor device is known in which the bonding wire
15
and the through-hole
14
are sealed only with potting resin. However, in order to enhance the reliability of the semiconductor device, recently, there has been a demand for a semiconductor device in which both the semiconductor chip
12
and the bonding wire
15
are sealed with the sealing resin
17
by means of transfer molding.
FIG. 9
is a view showing an example of the method of manufacturing the above semiconductor device made by means of transfer molding.
According to this manufacturing method, a large number of semiconductor chips are mounted on a wiring substrate of a predetermined width and molded at one time. After that, the resin-molded wiring substrate is cut off and separated into pieces of individual semiconductor devices.
On one face of the strip-like resin substrate
10
of the wiring substrate
18
, there are provided a plurality of rows of semiconductor chip mounting sections, which are arranged in the width direction of the resin substrate
10
by a number of pieces (in the case shown in the drawing, the number of pieces is three), in the longitudinal direction of the resin substrate. In the width direction of the resin substrate
10
, for each row of the semiconductor chip mounting sections, one through-hole
14
is arranged. On the other face of the resin substrate
10
, the wiring pattern
13
(not shown in
FIG. 9
) is arranged and is electrically connected with the terminal section of the semiconductor chip
12
, and is mounted on the semiconductor chip mounting section, via the bonding wire inserted into the through-hole
14
.
The semiconductor chip
12
is fixed to each semiconductor mounting section on the wiring substrate
18
with adhesive. After the terminal section of the semiconductor chip and the wiring pattern are connected with each other by the bonding wire, the wiring substrate
18
is incorporated into a metal mold as shown in FIG.
11
.
In the semiconductor chip mounting section on each row, one common through-hole (slit)
14
is formed. Therefore, when the semiconductor chip
12
is mounted in each semiconductor chip mounting section, the through-hole portion
14
a
not covered with the semiconductor chip
12
exists.
When sealing resin is injected into the metal mold in the direction A shown in the drawing, the injected resin flows from the through-hole portion
14
a
into the opposite side of the resin substrate
10
(the side on which the wiring pattern is formed) as shown in FIG.
11
. Accordingly, it is possible to conduct molding of the sealing resin on both the semiconductor chip
12
and the bonding wire
15
at one time. In this connection,
FIG. 11
is a sectional view taken on line a—a in
FIG. 9
, and
FIG. 12
is a sectional view taken on line b—b in FIG.
10
.
FIG. 10
is a view showing another manufacturing method. According to this manufacturing method, there is provided an independent through-hole (slit)
14
for each semiconductor chip mounting section. The length of this through-hole
14
is determined so that a portion
14
a
, which is not covered with the semiconductor chip
12
to be mounted, can be generated.
When the wiring substrate
18
is incorporated into the metal mold as shown in FIG.
12
and sealing resin is injected in the direction A shown in the drawing, the injected resin flows from the through-hole portion
14
a
into the opposite side of the resin substrate
10
as shown in FIG.
12
. Therefore, it is possible to conduct resin sealing on both the semiconductor chip
12
and the bonding wire
15
at the same time.
However, the following problems may be encountered in the above-mentioned conventional method of manufacturing the semiconductor device.
As shown in
FIGS. 11 and 12
, in either of the above manufacturing method, sealing resin simultaneously flows into the opposite side of the resin substrate
10
via the through-hole portion
14
a
. Therefore, by the pressure of resin which has flowed onto the wiring pattern forming side of the resin substrate
10
from the through-hole portion
14
a
, there is a tendency that the resin substrate
10
is pushed up. This is a disadvantageous aspect in this method of molding resin.
Due to the foregoing, sealing resin flows out between the resin substrate
10
and the metal mold parting face. Therefore, problems of leakage and a burr of the sealing resin are caused.
Since solvent is mixed in the sealing resin, even when the resin substrate is a hardly raised, the solvent bleeds onto the wiring pattern
13
and deposits on the formation face of the ball terminal
16
, which becomes an obstacle to the fixation of the ball terminal
16
.
SUMMARY OF THE INVENTION
The present invention has been accomplished to solve the above-mentioned problems.
An object of the present invention is to provide a method of manufacturing a semiconductor device capable of preventing leakage of resin, generation of burr and bleeding of solvent.
Another object of the present invention is to provide a wiring substrate preferably applied to the method of manufacturing the semiconductor device.
According to an aspect of the present invention, there is provided a wiring board adapted to be used for making a resin-molded type semiconductor device, said wiring board comprising: an insulating substrate having first and second surfaces, a plurality of semiconductor chip mounting sections arranged one by one along a predetermined direction on said first surface extending from one end to the other end of the substrate, and a resin transmitting port opened at said first and second surfaces of the substrate and penetrating therethrough, said resin transmitting port being located at a position in the vicinity of said one end along said predetermined direction and other than the semiconductor chip mounting section arranged nearest to said one end.
The substrate further has a plurality of through holes within the respective semiconductor chip mounting sections, in such a manner that, when a semiconductor chip is mounted on the semiconductor chip mounting section of the substrate, said through hole is completely covered by said semiconductor chip at the first surface and terminals of the semiconductor chip are exposed within said through hole.
The respective semiconductor chip mounting sections are all the same size and one equidistantly arranged along said predetermined direction.
The insulating substrate is a longitudinal strip-like resin sheet and said one direction is a width direction of the longitudinal sheet.
According to another aspect of the present invention, there is provided a wiring board adapted to be used for making a resin-molded type semiconductor device, said wiring board comprising an insulating substrate having first and second surfaces, a plurality of semiconductor chip mounting sections arranged one by one along a predetermined direction on said first surface extending from one end to the other end of the substrate, and a resin transmitting port opened at said first and second surfaces of the substrate and penetrating therethrough, said resin transmitting port being
Le Dung A.
Shinko Electric Industries Co. Ltd.
Staas & Halsey , LLP
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