Process of manufacturing a multichip module using a temporary su

Details Process of manufacturing a multichip module using a temporary su Process of manufacturing a multichip module using a temporary su

1994-08-31

1996-05-28

Fourson, George

Fishing, trapping, and vermin destroying

437215, H01L 2156, H01L 2158, H01L 2160, H01L 21283

Patent

active

055211224

ABSTRACT:
A multichip-module fabrication method includes the step of forming a chip-mounting substrate by forming a bonding layer on a supporting base and by forming one or a plurality of interconnection layers in a stack formation on the bonding layer via insulating layers. And this method includes the step of forming one or a plurality of throughholes extending through said insulating layers to said bonding layer on said chip-mounting substrate. And subsequently, this method separates said supporting base from said chip-mounting substrate by leading a treatment medium which is capable of removing said bonding layer to said bonding layer at least through said one or plurality of throughholes. Finally, by mounting a semiconductor chip on said chip-mounting substrate, the multichip-module fabrication method is completed.

REFERENCES:
patent: 4937203 (1990-06-01), Eichelberger et al.
patent: 5157589 (1992-10-01), Cole, Jr. et al.
patent: 5192716 (1993-03-01), Jacobs
patent: 5250843 (1993-10-01), Eichelberger et al.
patent: 5324687 (1994-06-01), Wojnarowski

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