Metal working – Method of mechanical manufacture – Electrical device making
Patent
1979-06-18
1981-06-09
Combs, Ervin M.
Metal working
Method of mechanical manufacture
Electrical device making
29588, 29589, 29834, 29832, 357 70, 357 72, H01R 4300
Patent
active
042715881
ABSTRACT:
A hybrid circuit including IC chips and discrete components wherein a substrate is connected to a lead frame and the lead frame is utilized for securing and positioning the substrate during the mounting and electrical connecting of IC chips and discrete components thereon. Once the entire circuit is connected the lead frame is utilized for securing and positioning the substrate in a transfer mold to encapsulate the substrate with epoxy or the like. In the present invention a pair of matching substrates having interconnected circuits thereon are constructed simultaneously and formed into two interconnected packages which can be tested before or after mounting in a receiving structure. Further, repairs may be made to the final assembly without destruction thereof, since the "component like" circuit package can be replaced without affecting other parts in the system.
REFERENCES:
patent: 3544857 (1970-12-01), Byrne et al.
patent: 3793714 (1974-02-01), Bylander
patent: 3922712 (1975-11-01), Stryker
patent: 4132856 (1979-01-01), Hutchison et al.
RCA Tech Notes 759, Apr. 1968.
Arbes C. J.
Combs Ervin M.
Motorola Inc.
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