Process of making an integrated circuit chip composite

Details Process of making an integrated circuit chip composite Process of making an integrated circuit chip composite

1996-07-05

1998-10-20

Niebling, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438124, H01L 2128

Patent

active

058245685

ABSTRACT:
A composite containing an integrated circuit chip having conductive site thereon and electrically conductive leads that are interconnected to the conductive site by electrically conductive wire; wherein the wire is coated with a dielectric material. Also, a method for fabricating the composite is provided.

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