Process of making an electronic device package with peripheral c

Details Process of making an electronic device package with peripheral c Process of making an electronic device package with peripheral c

1988-01-04

1989-06-06

Hearn, Brian E.

Fishing, trapping, and vermin destroying

26427211, 29856, 206328, 357 74, H01L 2166

Patent

active

048371840

ABSTRACT:
An electronic device package on a lead frame with a peripheral carrier structure holding the distal ends of the leads in rigid position. The carrier structure is spaced apart from the package body and permits the package to be handled and tested while protecting the leads. A different, relatively lower quality and less expensive material is used for the carrier structure than for the package body to reduce the cost of the package since the carrier structure may comprise several times, for example four times or more, the volume of the package body.

REFERENCES:
patent: 3267335 (1966-08-01), Walkow
patent: 4102039 (1978-07-01), Hendrickson et al.
patent: 4701781 (1987-10-01), Sankhagowit

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