Process of making an electronic circuit device having...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S832000, C029S835000, C029S841000, C029S830000, C156S233000, C156S235000, C156S239000, C174S254000, C174S260000, C174S536000, C174S538000, C438S127000

Reexamination Certificate

active

07617600

ABSTRACT:
An electronic circuit formed by removing only a baseboard from an electronic module. The electronic circuit may be formed by providing a baseboard made of a water-soluble material, applying a water-soluble polymer as an insulating material to the baseboard, and forming an electronic module by mounting electronic parts to wires formed on the baseboard. The formation of the electronic circuit may also include removing the baseboard from the electronic module by dissolving the baseboard in water and deforming and resin-encapsulating the electronic module, which includes the electronic parts and wires in the state of lacking the baseboard.

REFERENCES:
patent: 3729819 (1973-05-01), Horie
patent: 4303934 (1981-12-01), Stitt
patent: 4334352 (1982-06-01), VanBenthuysen
patent: 4877565 (1989-10-01), Tani et al.
patent: 6514847 (2003-02-01), Ohsawa et al.
patent: 2002/0192875 (2002-12-01), Igarashi et al.
patent: 55-016388 (1980-05-01), None
patent: 57130437 (1982-08-01), None
patent: 02-034986 (1990-02-01), None
patent: 7-29846 (1995-06-01), None
patent: 07-263847 (1995-10-01), None
patent: 2001-177224 (2001-06-01), None
patent: 2001-210998 (2001-08-01), None
patent: 04-036599 (2002-06-01), None
patent: 2002-234298 (2002-08-01), None
Lee, C. J., “SIM: New, Versatile Polymers for Electronic Industries”, Proceedings 39th Electronic Components Conference, pp. 896-900, May 1989.

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