Coating processes – Direct application of electrical – magnetic – wave – or... – Chemical vapor deposition
Patent
1998-05-13
2000-07-18
Tentoni, Leo B.
Coating processes
Direct application of electrical, magnetic, wave, or...
Chemical vapor deposition
20419211, 42725528, 427593, C23C 1434, C23C 1600
Patent
active
060904577
ABSTRACT:
The film-forming apparatus includes a gas introduction tube for introducing an inert gas into a vacuum chamber, a vapour source and a target, and forms a thin film by depositing sputtered particles and evaporated particles on the surface of a substrate, the sputtered particles being liberated by sputtering the target using ion energy of plasma generated around the target while the evaporated particles being obtained by evaporating a vapour source by heating and ionising evaporated components using the plasma. This apparatus comprises a substrate holder for holding the substrate so that its film-forming surface faces the side wall of the vacuum chamber; a rotating table for rotating the substrate holder within the vacuum chamber; a target arranged in the side wall of the vacuum chamber so that its sputtering surface faces the inside of the vacuum chamber; a shield detachably fitted in a through hole formed approximately through the centre of the target and having a hollow space therein; a gas introduction tube for introducing the inert gas into the hollow space of the shield; and a vapour source provided in the hollow space near the gas exit of the gas introduction tube. This apparatus is employed in the film-forming method of the present invention.
Kitabatake Akihiro
Yamada Keiji
Sanyo Vaccum Industries Co. Ltd.
Tentoni Leo B.
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