Process of making a glass semiconductor package

Details Process of making a glass semiconductor package Process of making a glass semiconductor package

1996-07-31

1999-09-28

Griffin, Steven P.

Glass manufacturing

Processes

Fusion bonding of glass to a formed part

65 48, 65 66, 65 85, 65122, 65DIG11, 257794, 438127, C03B 1900, H01L 2156, H01L 2329

Patent

active

059581000

ABSTRACT:
A process of making hermetically sealed glass semiconductor packages by injecting molding an electronic device within a body of molten thermoplastic glass which is solidified by cooling. The glass has a sealing temperature not over 350.degree. C. and a CTE not over 110.times.10.sup.-7 /.degree.C. and may be made of tin-phosphorus oxyfluoride or lead sealing glasses.

REFERENCES:
patent: 2961350 (1960-11-01), Flaschen et al.
patent: 2998558 (1961-08-01), Maiden et al.
patent: 3325586 (1967-06-01), Suddick
patent: 3442999 (1969-05-01), Yamamoto et al.
patent: 3493405 (1970-02-01), Thomas
patent: 3596136 (1971-07-01), Fischer
patent: 3639975 (1972-02-01), Teft
patent: 3763300 (1973-10-01), Spanjer
patent: 4046540 (1977-09-01), Lewis et al.
patent: 4133690 (1979-01-01), Muller
patent: 4285730 (1981-08-01), Sanford et al.
patent: 4323654 (1982-04-01), Tick et al.
patent: 4337182 (1982-06-01), Needham
patent: 4362819 (1982-12-01), Olszewski et al.
patent: 4532222 (1985-07-01), Butt
patent: 4641418 (1987-02-01), Meddles
patent: 4777520 (1988-10-01), Nambu et al.
patent: 4818730 (1989-04-01), Smith, III et al.
patent: 4855808 (1989-08-01), Tower et al.
patent: 4857483 (1989-08-01), Steffen et al.
patent: 4897509 (1990-01-01), Holleran et al.
patent: 4996170 (1991-02-01), Baird
patent: 5013360 (1991-05-01), Finkelstein et al.
patent: 5018003 (1991-05-01), Yasunaga et al.
patent: 5080980 (1992-01-01), Sakaguchi et al.
patent: 5086334 (1992-02-01), Eberlein
patent: 5089445 (1992-02-01), Francis
patent: 5089446 (1992-02-01), Cornelius et al.
patent: 5122862 (1992-06-01), Kajihara et al.
patent: 5155299 (1992-10-01), Mahulikar et al.
patent: 5177279 (1992-01-01), Karpman

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