Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1986-10-10
1987-12-22
Dawson, Robert A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156269, 156351, 156358, 156359, 156361, 156363, 156366, 156522, 156555, 156556, 100 93RP, B30B 1534, B30B 3104, B30B 3110
Patent
active
047145048
ABSTRACT:
A process for laminating discrete sections of a supported photosensitive layer onto a continuing series of sheet substrates. Each substrate is advanced to and through the nip of heated application rolls, and a continuous length of the supported photosensitive layer is also supplied to the nip. When the substrate reaches a first location positioned between the application rolls, all movement ceases except that the rolls move from an inactive disengaged position toward the substrate to an active position to cause pressure contact between the photosensitive layer and the substrate to thereby laminate the photosensitive layer to the substrate. There is a pause for a predetermined period of time with the rolls in the active positions before the substrate is again advanced with the rolls still in the active positions and the photosensitive layer again supplied to the nip. When the substrate reaches a second location, all motion ceases once again and there is another pause for another predetermined period of time with the rolls in the active positions after which the rolls are withdrawn to an inactive position. During the second pause, a successive substrate continues to advance toward the preceding stationary substrate. At appropriate times, the supported photosensitive layer is trimmed from the laminated photosensitive layer. The resulting laminated substrate is provided with well defined edges of the photosensitive layer where it is firmly laminated to the substrate along lines spaced from the leading and trailing edges of the substrate. This desirably results in an unlaminated margin adjacent the leading and trailing edges of the substrate.
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Cummings Michael J.
Hanford Donald E.
Japp Robert M.
Cuervo Lori
Dawson Robert A.
IBM Corporation
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