Process of joining silicon nitride bodies and insert for facilit

Details Process of joining silicon nitride bodies and insert for facilit Process of joining silicon nitride bodies and insert for facilit

1989-12-08

1991-09-03

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

264 60, 264 62, 264332, 428325, B32B 1800

Patent

active

050451375

ABSTRACT:
For reliably improving the strength of the composite body formed by hot-pressing together the silicon nitride surfaces at which parts of the composite body are joined, one of the silicon nitride surfaces to be joined is covered by a set of three thin layers applied by sputtering, the first a nitrogen-deficient layer of SiN.sub.x where 1.3>x and .gtoreq.0, a second layer of SiN.sub.y in which y>1.33 and a third layer like the first. The first and third layers have the same thickness and the second layer has twice that thickness. The three layers together have a thickness not exceeding 3 .mu.m and the overall composition of the set of three layers is Si.sub.3 N.sub.4. With such a set of layers, the wetting of the surfaces of the bodies to be joined during hot-pressing is substantially improved, resulting in better bonding of the parts across the joint seam. An insert of silicon nitride fitting between the surfaces to be pressed together and coated on both sides with respective sets of three layers, as above described, is useful for facilitating a hot-pressed joint.

REFERENCES:
patent: 3966885 (1976-06-01), May
patent: 4347089 (1982-08-01), Loehman
patent: 4484972 (1984-11-01), Ebata et al.
patent: 4917843 (1990-04-01), Gyarmati et al.

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