Process of heat treating copper film on ceramic body and heat tr

Metallurgical apparatus – Means treating solid metal – By contact with gas

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266250, 266251, 432253, C21D 106

Patent

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044024940

ABSTRACT:
A process for metallizing a copper film comprising the step of heat treating a copper film formed by an electroless plating process as opposing electrodes of a ceramic capacitor. The process comprises the steps of placing a ceramic body having a copper film formed on the surface thereof by an electroless plating process within a container sealing the same from the external atmosphere and maintaining constant the internal atmosphere, and heating the container maintaining the surrounding of the container in an inert atmosphere.

REFERENCES:
patent: 1270519 (1918-06-01), Henderson
patent: 1824747 (1931-09-01), Coriolis
patent: 3183130 (1965-05-01), Reynolds et al.
patent: 4147506 (1979-04-01), Southern et al.
patent: 4165868 (1979-08-01), Southern
patent: 4223877 (1980-09-01), Sanderson

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