Process of gettering semiconductor devices

Metal working – Method of mechanical manufacture – Assembling or joining

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29575, 29576T, 136243, 148 15, 148174, 148DIG60, 148DIG61, 426 86, H01L 2120, H01L 21322

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active

045611718

ABSTRACT:
The invention relates to a process for gettering semiconductor devices. A getter layer of amorphous or microcrystalline silicon is applied to the device. The so coated device is thermally treated and the getter layer is removed.

REFERENCES:
patent: 3632438 (1972-01-01), Carlson et al.
patent: 3701696 (1972-10-01), Mets
patent: 3919765 (1975-11-01), Schloetterer
patent: 3929529 (1975-12-01), Poponiak
patent: 4001864 (1977-01-01), Gibbons
patent: 4053335 (1977-10-01), Hu
patent: 4134125 (1979-01-01), Adams et al.
patent: 4339470 (1982-07-01), Carlson
patent: 4396437 (1983-08-01), Kwok
IBM Technical Disclosure Bulletin, vol. 20, No. 9, Feb. 1978, by Poponiak et al.
IEEE Transactions on Electron Devices, "Impurity Gettering of Polycrystalline Solar Cells Fabricated from Refined Metallurgical-Grade Silicon," vol. ED-27, No. 4, Apr. 1980, by Saitoh et al.
Chen et al., "Post Epitaxial Polysilicon and Sl.sub.3 N.sub.4 Gettering in Silicon", J. Electrochem. Soc.: Solid State Science and Technology, vol. 129, No. 6, pp. 1294 to 1299, Jun. 1982.
Pearce et al., "Considerations Regarding Gettering in Integrated Circuits", Semiconductor Silicon, 1981, The Electrochemical Society, pp. 705 to 723.

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