Process of forming multilayer circuit boards

Details Process of forming multilayer circuit boards Process of forming multilayer circuit boards

1995-10-11

1997-09-30

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1563077, 361790, 174262, 29830, H05K 336

Patent

active

056722265

ABSTRACT:
A process is provided for forming multilayer laminated circuit boards characterized by high circuit component density. The process generally employs a pair of plies, each of which is formed to include a dielectric prepreg bonded to a conductive foil. Vias are formed through the dielectric prepregs and conductive foils, and then filled with a conductive material, such as a conductive adhesive or conductive ink, such that the conductive material electrically contacts the conductive foils. Finally, the plies are laminated to opposing surfaces of a clad core laminate composed of a dielectric core between a pair of conductive claddings. The plies are laminated to the core laminate such that the prepregs overlay the conductive claddings of the core laminate. In so doing, the conductive material within the vias electrically contacts the pair of conductive claddings of the core laminate, thereby electrically interconnecting the conductive claddings of the core laminate with the conductive foils.

REFERENCES:
patent: 5463191 (1995-10-01), Bell et al.

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