Process of forming electrical connections between conductive lay

Details Process of forming electrical connections between conductive lay Process of forming electrical connections between conductive lay

1991-11-18

1993-03-30

Chaudhuri, Olik

Metal working

Method of mechanical manufacture

Electrical device making

29846, H05K 340, H05K 346

Patent

active

051971852

ABSTRACT:
The process of the present invention allows interconnecting one conductive layer to another in a Multichip Module. The process uses bumps formed by wire bonding, or any other means of forming bumps of 0.002"-0.004" height with comparable diameter. These bumps create an opening through dielectric insulating layers, thereby allowing one conductive layer to be electrically connected to the next conductive layer.

Affiliated with

Also associated with

Rating

Process of forming electrical connections between conductive lay does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process of forming electrical connections between conductive lay, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process of forming electrical connections between conductive lay will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1272631