Process of forming an electronic device including a layer...

Details Process of forming an electronic device including a layer... Process of forming an electronic device including a layer...

2006-04-24

2009-02-17

Lee, Calvin (Department: 2892)

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Grooved and refilled with deposited dielectric material

C257S647000

Reexamination Certificate

active

07491622

ABSTRACT:
A process of forming an electronic device can include patterning a semiconductor layer to define an opening extending to an insulating layer, wherein the insulating layer lies between a substrate and the semiconductor layer. After patterning a semiconductor layer, the semiconductor layer can have a sidewall and a surface, the surface can be spaced apart from the insulating layer, and the sidewall can extend from the surface towards the insulating layer. The process can also include chemical vapor depositing a first layer adjacent to the sidewall, wherein the first layer lies within the opening and adjacent to the sidewall, and is spaced apart from the surface. Chemical vapor depositing the first layer can be performed using an inductively coupled plasma.

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