Process of forming a tri-layer titanium coating for an aluminum

Details Process of forming a tri-layer titanium coating for an aluminum Process of forming a tri-layer titanium coating for an aluminum

1991-10-15

1993-07-27

Maples, John S.

Fishing, trapping, and vermin destroying

437192, 437194, H01L 2144

Patent

active

052310531

ABSTRACT:
A tri-layer titanium coating for an aluminum layer of a semiconductor device. An aluminum layer used for interconnecting individual devices of an integrated circuit is formed on a semiconductor material. A first titanium nitride layer is deposited on the aluminum layer. A titanium layer is deposited on the first titanium nitride layer. A second titanium nitride layer is then deposited on the titanium layer. The tri-layer titanium coating prevents the formation of Al.sub.2 O.sub.3 and AlF.sub.3 during the etching of a via hole in an intermetal dielectric layer deposited above the second titanium nitride layer.

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