Process of forming a rigid-flex circuit

Details Process of forming a rigid-flex circuit Process of forming a rigid-flex circuit

1990-08-09

1992-03-17

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

156289, 156313, 439 67, H05K 302

Patent

active

050956280

ABSTRACT:
In a process for manufacturing a rigid-flex printed circuit wherein a rigid insulating layer supports one portion of the printed circuit and a flexible insulator supports another portion thereof to furnish flexible leads for connection the printed circuit to an operative device, a first assembly is provided comprising a curable prepreg insulator layer having an opening for the flexible leads. A flexible sheet spans the opening, and the assembly is pressed with one surface in contact with a smooth hard surface while the other surface is supported by a flowable curable prepreg layer. The insulator and flowable layers are a release layer which prevents bonding between the prepreg layers throughout most of the areas while permitting bonding along the edges. The assembly is maintained under heat and pressure to partially cure both prepreg layers and bond the flexible sheet to the edges of the opening and bond the edges of the prepregs together to form a flat rigid sandwich. A sheet of copper is bonded to that surface previously in contact with the hard surface. In a second pressing operation the copper is bonded to both the partially cured prepreg layer and the flexible sheet, and thereafter the bonded edges of the cured prepreg layers, are severed to permit separation of the cured prepreg layers.

REFERENCES:
patent: 3393392 (1968-07-01), Shelley
patent: 4001466 (1977-01-01), Shaul et al.
patent: 4191800 (1980-03-01), Holtzman
patent: 4808461 (1989-01-01), Dixon et al.
patent: 4857400 (1989-08-01), Kloss, Jr.
patent: 4931134 (1990-06-01), Hatkevitz et al.
IBM Tech. Discl. Bull., vol. 14, No. 3, Aug. 1971, pp. 701-702, by F. P. Ardito et al.

Affiliated with

Also associated with

Rating

Process of forming a rigid-flex circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process of forming a rigid-flex circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process of forming a rigid-flex circuit will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1467169