Process of fabrication IC chip package from an IC chip carrier s

Details Process of fabrication IC chip package from an IC chip carrier s Process of fabrication IC chip package from an IC chip carrier s

1993-05-19

1995-04-04

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437182, 437206, 437209, 437217, H01L 2160

Patent

active

054037859

ABSTRACT:
An IC chip package is fabricated from a substrate carrying an IC chip and formed with a conductive pattern of conductors for electrical connection to the IC chip, and a leadframe having a plurality of connector leads with inner and outer lead sites for electrical connection with associated ones of the conductors and with an external circuit, respectively. Fabrication of the IC chip package is made through the steps of placing the inner lead sites into intimate contact on distal ends of the corresponding conductors, and applying ultrasonic vibrations to contacting surfaces between the inner lead sites and the conductors so as to effect diffusion bonding therebetween. For applying the ultrasonic vibrations, a horn is pressed against the inner lead sites of the connector leads in such a manner as to leave indents in the inner lead sites which act to anchor an encapsulating plastic at the time of encapsulating the IC chip, the substrate, and most of the leadframe, for obtaining tight grip between the encapsulating plastic and the connector leads. At least one of the inner lead site and the distal end of the corresponding conductor may be provided with a suitable plating or bump for facilitating the diffusion bonding.

REFERENCES:
patent: 4413404 (1983-11-01), Burns
patent: 4776509 (1988-10-01), Pitts et al.
patent: 4800178 (1989-01-01), Mathew et al.
patent: 4994412 (1991-02-01), Kalfus et al.
patent: 5001545 (1991-03-01), Kalfus et al.
patent: 5040293 (1991-08-01), Yamazaki et al.

Affiliated with

Also associated with

Rating

Process of fabrication IC chip package from an IC chip carrier s does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process of fabrication IC chip package from an IC chip carrier s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process of fabrication IC chip package from an IC chip carrier s will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2380554