Process of fabricating polymer sustained microelectrodes

Etching a substrate: processes – Forming or treating electrical conductor article

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C216S002000, C216S041000, C216S083000, C216S100000, C438S689000, C438S706000, C438S745000

Reexamination Certificate

active

10761902

ABSTRACT:
A process for fabricating a microelectrode is described that includes: a) providing a substrate comprising at least one polymer micro-ridge, where the polymer micro-ridge comprises an upper surface and two walls, and the two walls form an angle with a lower surface; b) depositing a metal thin film on the upper surface, the two walls, and the lower surface; and c) etching a predetermined amount of the deposited metal thin film on the lower surface to form the microelectrode.

REFERENCES:
patent: 5120339 (1992-06-01), Markovich et al.
patent: 5198513 (1993-03-01), Clement et al.
patent: 5219788 (1993-06-01), Abernathey et al.
patent: 5223356 (1993-06-01), Kumar et al.
patent: 5370969 (1994-12-01), Vidusek
patent: 5433895 (1995-07-01), Jeng et al.
patent: 5480687 (1996-01-01), Heming et al.
patent: 5497445 (1996-03-01), Imoto
patent: 5631735 (1997-05-01), Nagai
patent: 5635576 (1997-06-01), Foll et al.
patent: 5714304 (1998-02-01), Gibbons et al.
patent: 5729641 (1998-03-01), Chandonnet et al.
patent: 5776374 (1998-07-01), Newsham et al.
patent: 5783319 (1998-07-01), Reisfeld et al.
patent: 5811507 (1998-09-01), Chan et al.
patent: 5861976 (1999-01-01), Hoekstra
patent: 5887116 (1999-03-01), Grote
patent: 6002828 (1999-12-01), Hult et al.
patent: 6019906 (2000-02-01), Jang et al.
patent: 6020110 (2000-02-01), Williams et al.
patent: 6031945 (2000-02-01), You et al.
patent: 6060170 (2000-05-01), Burgoyne, Jr.
patent: 6117967 (2000-09-01), Fuller et al.
patent: 6126867 (2000-10-01), Kanitz et al.
patent: 6229949 (2001-05-01), Ido et al.
patent: 6294573 (2001-09-01), Curtin et al.
patent: 6303730 (2001-10-01), Fries et al.
patent: 6306563 (2001-10-01), Xu et al.
patent: 6323361 (2001-11-01), Wu et al.
patent: 6335149 (2002-01-01), Xu et al.
patent: 6419989 (2002-07-01), Betz et al.
patent: 6451240 (2002-09-01), Sherman et al.
patent: 6466707 (2002-10-01), Dawes et al.
patent: 6473551 (2002-10-01), Norwood et al.
patent: 6525867 (2003-02-01), Oakley et al.
patent: 6544820 (2003-04-01), Jiang et al.
patent: 6852563 (2005-02-01), Dinu et al.
patent: 2002/0160282 (2002-10-01), Huang et al.
patent: 2003/0085398 (2003-05-01), Koyama et al.
patent: 961139 (1999-01-01), None
patent: 04238305 (1992-08-01), None
patent: 09258151 (1997-10-01), None
patent: 10049443 (1998-02-01), None
patent: 10232323 (1998-09-01), None
patent: 2001255426 (2001-09-01), None
patent: WO 01/40849 (2001-06-01), None
patent: WO 2004/055897 (2004-07-01), None
U.S. Appl. No. 10/264,461, Dinu et al.
U.S. Appl. No. 10/301,978, Huang et al.
Bailey et al., “Step and flash imprint lithography: Template surface treatment and defect analysis,”J. Vac. Sci. Technol. B, 2000, 18(6):3572-3577.
Chen et al., “Thermosetting Polyurethanes with Stable and Large Second-Order Optical Nonlinearity,”Macromolecules, 1992, 25:4032-4035.
Grote et al., “Effect of conductivity and dielectric constant on the modulation voltage for optoelectronic devices based on nonlinear optical polymers,”Opt. Eng., 2001, 40(11):2464-2473.
Ma et al., “A Novel Class of High-Performance Perfluorocyclobutane-Containing Polymers for Second-Order Nonlinear Optics,”Chem. Mater., 2000, 12:1187-1189.
Ma et al., “Highly Efficient and Thermally Stable Nonlinear Optical Dendrimer for Electrooptics,”J. Am. Chem. Soc., 2001, 123:986-987.
Mao et al., “Progress toward Device-Quality Second-Order Nonlinear Optical Materials. 1. Influence of Composition and Processing Conditions on Nonlinearity, Temporal Stability, and Optical Loss,”Chem. Mater., 1998, 10:146-155.
Oh et al., “Electro-optic polymer modulators for 1.55 μm wavelength using phenyltetraene bridged chromophore in polycarbonate,”Appl. Phys. Lett., 2000, 76(24):3525-3527.
Resnick et al., “Release Layers for Contact and Imprint Lithography,”Semicon. Int., Jun. 2002, online version, 7 pgs.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process of fabricating polymer sustained microelectrodes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process of fabricating polymer sustained microelectrodes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process of fabricating polymer sustained microelectrodes will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3767004

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.