Process of fabricating high frequency connections to high temper

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29840, 29842, 29846, 29852, 174255, 174256, 174262, H01R 900

Patent

active

060557230

ABSTRACT:
The invention relates to a method for producing an electrical connection to a high temperature superconductor (HTS) circuit, where a polymer material is applied to the HTS surface covering the circuit contact disposed on one surface of the HTS circuit, a via is created in the polymer material exposing the circuit contact, a diffusion barrier is applied into the via covering the circuit contact; and, a solder bump is applied to the diffusion barrier.

REFERENCES:
patent: 4284659 (1981-08-01), Jaccodine et al.
patent: 5055319 (1991-10-01), Bunshah et al.
patent: 5564180 (1996-10-01), Chen et al.
patent: 5706578 (1998-01-01), Hubner
patent: 5712192 (1998-01-01), Lewis et al.
patent: 5743006 (1998-04-01), Beratan
patent: 5758413 (1998-06-01), Chong et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process of fabricating high frequency connections to high temper does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process of fabricating high frequency connections to high temper, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process of fabricating high frequency connections to high temper will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1584213

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.